半導體產業
Wafer 晶圓檢測系統 Wafer Inspection System | Die 晶粒檢測系統 Die Saw Inspection |
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- wafer dimensions - wafer defect | - Die dimensions - Die saw - Die chip edges - Die FM - Die Ink / Test |
Leadframe 導線架檢測系統 Leadframe Inspection | Die Bonding 黏晶檢測系統 Die Bonding Inspection Die Inspection Items |
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- Leadframe dimensions - Leadframe placement offset - Leadframe defect | - Die missing - Die placement - offset - Die rotation offset - Die defect - Die wrong |
Wire Bonding 銲點檢測系統 Wire Bonding Inspection Wire Ball Inspecting Items | Wire Bonding 檢測系統 Wire Bonding Inspecting Items |
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- Ball missing - Ball placement - Ball size - Ball broken - Ball defect | - Wire broken - Wire missing - Wire unbonded - Wire short - Wire height - Wire close gap - Wire height - Wire sway |
凸塊檢測系統 Bumping Inspection Items | Probe Card 探針卡檢測系統 Probe Card Inspection System Probe Card PIN Inspecting and Adjustment Items |
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- Bump ball missing - Bump ball placement - Bump ball size - Bump ball broken | - PIN missing - PIN broken - PIN placement - PIN offset - PIN size - PIN height - PIN level |
PIS 探針卡檢測及調針系統
PIS Series for Probe Card PIN Inspection and Adjustment
越南永聯國際是台灣ARCS影像測量系統的越南代理,有需要的客戶歡迎參考選購
越南熱線 Hotline:0963-279153 (Tiếng Việt) , 0977-837630 (中文)
台灣服務窗口:Ms.Diana, Email: info@arcs-trade.com
Email: mail@vinhlien.com